About this Journal Submit a Manuscript Table of Contents
ElectroComponent Science and Technology
Volume 7 (1980), Issue 1-3, Pages 143-147
http://dx.doi.org/10.1155/APEC.7.143

Foil Circuits

Siemens AG, Unternehmensbereich Bauelemente Folien-Produkte (Werk Kondensatoren), Balanstraße 73, München 80 8000, Germany

Received 22 February 1980

Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Progress in integration of passive components is of essential importance for many applications along with the high integration rate of semiconductors. A further asset in view of the integration of passive components, like the field of peripheral circuits, is a new technology on the base of low-cost plastic materials, called Sicufol®. With this new technology it is possible to integrate capacitors, coils and NiCr-resistors. Investigations shows that passive components with very good properties can be produced. A summary of climatic tests carried out on NiCr-resistors with Cu-contacts and capacitances are shown. HF-applications and some low frequency applications (e.g. a simple resistor network) show that conventional or hybrid components can be soldered on plastic foils using this technology.