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ElectroComponent Science and Technology
Volume 8 (1981), Issue 1-2, Pages 15-19
http://dx.doi.org/10.1155/APEC.8.15

Tape Automated Bonding for High Density Packaging

CII-Honeywell Bull, Rue Jean Jaurès, Les Clayes-sous-Bois 78 340, France

Copyright © 1981 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

High density packaging of semiconductor devices is necessary for high performance in compact electronic systems. But the assembly technology must also remain cost attractive.

Through the development efforts conducted during the past years in the world, the Tape Automated Bonding – TAB – has become the assembly technology allowing a very high density packaging. In combination with substrate technology it has grown into a complete, cost effective, micropackaging concept.

The paper describes the main technical characteristics of this packaging concept. Specific equipments for TAB were designed and built by CII-Honeywell Bull for installation in the factory. These equipments are not only those, directly related to the TAB technology processing steps but include also other equipments like high precision thick film printer.

The main features of the new micropackaging facility are also presented. Some examples of high density packages built with tape automated bonding are described and some of the main quality and reliability aspects are discussed.