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International Microelectronics Conference. Part I
- Editorial, D. S. Campbell
Volume 8 (1981), Issue 1-2, Pages 1-1 - Thin Film Technology Used in Bell System Telecommunication Circuits, Walter Worobey
Volume 8 (1981), Issue 1-2, Pages 3-8 - Thick Film Circuits for Telecommunications Equipment, William B. Grupen and Howard M. Cohen
Volume 8 (1981), Issue 1-2, Pages 9-13 - Tape Automated Bonding for High Density Packaging, Karel Kurzweil
Volume 8 (1981), Issue 1-2, Pages 15-19 - Solder Paste Process of Hybrid Circuits, Hayato Takasago, Kohei Adachi, Youichiro Ohnishi, and Kazuo Tazuke
Volume 8 (1981), Issue 1-2, Pages 21-25 - Process and Accelerated Aging Test of GANG Bonding for Gold-Plated
TAB Outer Leads, M. Nitta, T. Tsuge, Y. Hiki, and R. Kato
Volume 8 (1981), Issue 1-2, Pages 27-36 - Automatic Production System for Circuit Boards With Universal Hybrid
Integrated Circuits, Mitsuo Ohsawa
Volume 8 (1981), Issue 1-2, Pages 37-44 - Functional Laser Trimming of Automotive Electronics, Junji Mitobe and Chris Davison
Volume 8 (1981), Issue 1-2, Pages 45-46 - A New Type of Film Driver, Masato Murata, Shohei Akitake, Hitoshi Yamaguchi, Hajime Sasaki, and Shiro Otani
Volume 8 (1981), Issue 1-2, Pages 47-52 - Integrated Monolithic Crystal Filter for Citizen Band Transceivers, Masaaki Ono, Shigeo Tanji, and Hideki Tominaga
Volume 8 (1981), Issue 1-2, Pages 53-59 - An Air Firing Base Metal Resistor and Conductor System for Low Cost
Thick Film Circuit Manufacture, E. K. Browne and B. Walton
Volume 8 (1981), Issue 1-2, Pages 61-65 - Application of Hybrid IC's to the Automotive Electronics Market in
Europe, Eckart von Roda
Volume 8 (1981), Issue 1-2, Pages 67-76 - New Thick Film Functional Devices, Y. Taketa, O. Abe, and M. Haradome
Volume 8 (1981), Issue 1-2, Pages 77-82 - Low-Value Nickel Resistors Electroless-Plated on “IMST” Substrate
for Power Hybrid ICs, N. Miura, Y. Fuura, and A. Kazami
Volume 8 (1981), Issue 1-2, Pages 83-89 - Multi-Layer 2 Mil Line Technology, Tamio Saito and Yoshikatsu Fukumoto
Volume 8 (1981), Issue 1-2, Pages 91-98 - Photochemical Image Formation Process for High Density Printed
Circuit Patterns, Katsuhiro Takahashi, Kunihiro Ikari, Jiro Kano, Tsutomu Takamura, Toshihiro Ueki, Tsuguo Yamaoka, and Takahiro Tsunoda
Volume 8 (1981), Issue 1-2, Pages 99-102 - Development of Substrate Carrier System, N. Miura, Y. Fuura, and K. Uchida
Volume 8 (1981), Issue 1-2, Pages 103-109 - Fabrication of Nonreciprocal Microwave Components Using Thick Film
Ferrimagnetic Pastes, Chinmay. K. Maiti, D. Bhattacharyya, and N. B. Chakrabarti
Volume 8 (1981), Issue 1-2, Pages 111-114 - Selective Glaze for Last Line Visible Thermal Head, Kaoru Hashimoto, Nobuo Kamehara, Minoru Terashima, and Koichi Niwa
Volume 8 (1981), Issue 1-2, Pages 115-121 - Book Reviews
Volume 8 (1981), Issue 1-2, Pages 123-124 - Conference Diary
Volume 8 (1981), Issue 1-2, Pages 125-127 - Announcement
Volume 8 (1981), Issue 1-2, Pages 128-128