This paper describes the thin film technology used for telecommunication circuits in the Bell System. Vacuum
deposition and photolithography form the basis for the film processing steps. Nitrogen doped tantalum films are used
to form the very stable thin film resistors and capacitors. Laser trimming is used to obtain precision RC active filters.
Line widths down to 75 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mi>&#x03BC;</mml:mi></mml:math>m for conductors and 50 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mi>&#x03BC;</mml:mi></mml:math>m for resistors are readily achieved in production. The properties
of the various components used in thin film integrated circuits are described and examples of completed circuits used
in transmission, station, and switching systems are shown. Some key advantages of this technology are low cost due to
batch processing techniques, high packing density and high precision of passive components.

Walter  Worobey

Thin Film Technology Used in Bell System Telecommunication Circuits

This paper will describe a SSB 10.7 MHz IF filter for CB band transceivers employing an integrated capacitor circuit
and four dual mode Monolithic Crystal Filters (MCFs) of AT cut Quartz. With a narrow bandwidth of 2 &#215; 10&#8722;4, an
insertion loss of less than 5 dB, and a low temperature coefficient of the center frequency of within &#177; 20 ppm over the
range of &#8722; 35 to + 65&#8451;, this filter also meets mechanical shock-resistance requirements. The integrated capacitor
circuit consists of thin film Ta2O5 capacitors and interdigital gap capacitors formed on both sides of a Fine Grain
Alumina (FGA) substrate. Four MCFs are directly soldered to the substrate of the integrated capacitor circuit,
allowing this filter to be made smaller and lighter and have better resistance to mechanical shock. Also important, the
manufacturing process is suitable for mass production.

Masaaki  Ono

Shigeo  Tanji

Hideki  Tominaga

Integrated Monolithic Crystal Filter for Citizen Band Transceivers

This paper describes the critical factors required for the solder paste process and its applications to Hybrid Circuits
(Solder Paste Process). It also describes the fine solder printing of substrate pads for flip chip IC and the
simultaneously thick printing of solder paste for chip capacitors and/or other parts.Through this &#8220;Solder Paste Process&#8221;, assemblies of good quality and higher yields are achieved. The results of
various evaluation and reliability tests were excellent. From this study, some new applications of solder paste are
presented.

Hayato  Takasago

Kohei  Adachi

Youichiro  Ohnishi

Kazuo  Tazuke

Solder Paste Process of Hybrid Circuits

Multi-layer 2 mil line technology has been increasingly required for VLSI and very high speed logic devices. This
technology makes it possible to shorten the length of interconnection lines between VLSI silicon chips. Thus the signal
propagation delay on the transmission lines can be minimized.Multi-layer 2 mil line technology research history, the new method and usages are discussed in this paper.

Tamio  Saito

Yoshikatsu  Fukumoto

Multi-Layer 2 Mil Line Technology

A new method for fabricating high density printed circuit boards has been investigated. The procedure used for
photoselective metal deposition on the substrate consists of five steps: adhesion treatment, sensitization, nucleation,
fog inhibition and electroless metal deposition. An adhesive coated substrate was sensitized by introducing an aqueous
solution containig anthraquinone sulfonic acid sodium salts, reducible noble metal salts and alcohol. The sensitized
substrate was then exposed through a mask to a u.v. light. The noble metal nuclei produced by exposure were
developed by electroless copper deposition after rinsing with aqueous solutions containing complex agents.
Electrically-conductive patterns thus obtained can be further intensified by second electroless plate making.

Katsuhiro  Takahashi

Kunihiro  Ikari

Jiro  Kano

Tsutomu  Takamura

Toshihiro  Ueki

Tsuguo  Yamaoka

Takahiro  Tsunoda

Photochemical Image Formation Process for High Density Printed
Circuit Patterns

In the 1970&#39;s, much development occurred in monolithic IC&#39;s and automatic insertion machines, which brought about
extensive changes among mass producers of electronic consumer products and greatly influenced the improvement of
quality and the saving of labor in production. The challenges of the next era are the achievement of the following four
objectives in addition to the quality improvement and labor saving objectives involved in the recent decade. 1) The
efficient use of material resources to eliminate waste, 2) elevation of reliability, 3) striving for uniform specifications for
components on a worldwide basis to achieve more rational and efficient operations, and 4) the creation of unique
products through new mounting and assembly techniques. Towards these objectives, a unique technology has been
developed which has been named &#8216;universal hybrid integrated circuits&#8217; (UHIC), for which the automatic production
system has been put into practical use. The various components used in assembling through this system are cylindrical
in shape and entirely new in concept. They are called &#8216;metal electrode facebonding&#8217; (MELF) type components. The
new production system has the capacity of mounting 600 components simultaneously and can handle circuit
boards up to a size of 330 millimeters per side. This means that a stereo unit or a color television set can easily be
assembled on one circuit board, which could be called &#8220;all-in-one UHIC&#8221;.

Mitsuo  Ohsawa

Automatic Production System for Circuit Boards With Universal Hybrid
Integrated Circuits

The Substrate Carrier System (S. C. System) is a new manufacturing technique for small size hybrid IC with IMST
(Insulated Metal Substrate Technology)substrate which is used for power hybrid IC (STK series). The point of this
system is to treat both substrate process and assembly process in the manufacturing process of hybrid IC, with several
IC substrates at the same time. In the printing process, multi-IC pattern are made on a large IMST substrate at the
same time and the substrate after completion of printing process are slit-punched to have the frame configuration
where individual IC substrates are conected by tie-bar. Moreover in the assembly process which involves
die-bonding and wire-bonding, the substrate is carried by the pitch of IC substrate, utilizing the frame construction,
which can provide the automatic processes.This Substrate Carrier System is applied to many kinds of hybrid IC for low-frequency applications as a system of
high reliability and productivity.

N.  Miura

Y.  Fuura

K.  Uchida

Development of Substrate Carrier System

This paper presents the evaluation results of thermocompression GANG Bonding of gold-plated TAB outer leads to
three kinds of metallized ceramic substrates. Gold-Selective Plating (GSP) substrates for multi-chip package, Thick
Film (TF) substrates for multi-chip package and Single Chip Packages (SCP) which have a trimetal combination of
refractory metal (tungsten), Nickel and Gold.The bonding parameters such as the bonding tool (thermode) temperature, pressure, bonding time and preheat
temperature were examined on each substrate to get optimum values. As the result, a relation between pull strength
and the lead deformation shows that the TAB leads should be bonded with 15&#8211;65 percent deformation, the recommended parameters are; the tool temperature of 380&#8211;430&#8451;, the bonding pressure ranging from 35 to
45 kg/mm2, with the preheat temperature of 150&#8451; and the bonding time from 1.0 to 2.5 seconds.The evaluation of initial bondability shows that TAB GANG Bonding has the capability of excellent bonding
strength; above 120 grams with standard deviation of less than 20 grams, and the necessity of OLB pads flatness; less
than &#177;12 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mi>&#x03BC;</mml:mi></mml:math>m for one ounce copper lead. The normal storage of the substrate and the lead does not affect the
bondability. And the results of accelerated aging test of 125&#8451;, 150&#8451; and 175&#8451; for more than 8,000 hours show
that a lifetime of greater than 70 years at 65&#8451; operating temperature is predicted. The effective activation energy for
the pull strength degradation is 0.86&#8211;1.05 eV. This is in reasonable agreement with predictions for interdiffusion of
Cu&#8211;Au. And no significant degradation of the electric resistance was observed on the GSP samples.The feasibility and the high reliability of the GANG Bonding for gold-plated TAB outer leads were confirmed.

M.  Nitta

T.  Tsuge

Y.  Hiki

R.  Kato

Process and Accelerated Aging Test of GANG Bonding for Gold-Plated
TAB Outer Leads

D. S. Campbell

Editorial

This paper reports results of investigations on edge guided mode circulators and junction circulators using thick film
ferrimagnetic pastes in the frequency range from 2 to 12 GHz. Performance of the circulators realized with the thick
film ferrimagnetic pastes will be compared with those made on YIG substrates in respect of insertion loss, isolation
and bandwidth. The study shows that while good isolation bandwidth is obtainable with edge guided mode circulators,
the insertion loss remains high.

Chinmay. K. Maiti

D. Bhattacharyya

N. B. Chakrabarti

Fabrication of Nonreciprocal Microwave Components Using Thick Film
Ferrimagnetic Pastes

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Active and Passive Electronic Components provides a forum for the science and technology of all types of electronic components, and publishes experimental and theoretical papers on topics such as transistors, hybrid circuits and sensors.

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Active and Passive Electronic Components

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Active and Passive Electronic Components

International Microelectronics Conference. Part I

International Microelectronics Conference. Part I

Articles

Thin Film Technology Used in Bell System Telecommunication Circuits

Integrated Monolithic Crystal Filter for Citizen Band Transceivers

Solder Paste Process of Hybrid Circuits

Multi-Layer 2 Mil Line Technology

Photochemical Image Formation Process for High Density Printed Circuit Patterns

Automatic Production System for Circuit Boards With Universal Hybrid Integrated Circuits

Development of Substrate Carrier System

Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads

Editorial

Fabrication of Nonreciprocal Microwave Components Using Thick Film Ferrimagnetic Pastes