International Microelectronics Conference. Part I

• Editorial, D. S. Campbell
  Volume 8 (1981), Issue 1-2, Pages 1-1
• Thin Film Technology Used in Bell System Telecommunication Circuits, Walter Worobey
  Volume 8 (1981), Issue 1-2, Pages 3-8
• Thick Film Circuits for Telecommunications Equipment, William B. Grupen and Howard M. Cohen
  Volume 8 (1981), Issue 1-2, Pages 9-13
• Tape Automated Bonding for High Density Packaging, Karel Kurzweil
  Volume 8 (1981), Issue 1-2, Pages 15-19
• Solder Paste Process of Hybrid Circuits, Hayato Takasago, Kohei Adachi, Youichiro Ohnishi, and Kazuo Tazuke
  Volume 8 (1981), Issue 1-2, Pages 21-25
• Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads, M. Nitta, T. Tsuge, Y. Hiki, and R. Kato
  Volume 8 (1981), Issue 1-2, Pages 27-36
• Automatic Production System for Circuit Boards With Universal Hybrid Integrated Circuits, Mitsuo Ohsawa
  Volume 8 (1981), Issue 1-2, Pages 37-44
• Functional Laser Trimming of Automotive Electronics, Junji Mitobe and Chris Davison
  Volume 8 (1981), Issue 1-2, Pages 45-46
• A New Type of Film Driver, Masato Murata, Shohei Akitake, Hitoshi Yamaguchi, Hajime Sasaki, and Shiro Otani
  Volume 8 (1981), Issue 1-2, Pages 47-52
• Integrated Monolithic Crystal Filter for Citizen Band Transceivers, Masaaki Ono, Shigeo Tanji, and Hideki Tominaga
  Volume 8 (1981), Issue 1-2, Pages 53-59
• An Air Firing Base Metal Resistor and Conductor System for Low Cost Thick Film Circuit Manufacture, E. K. Browne and B. Walton
  Volume 8 (1981), Issue 1-2, Pages 61-65
• Application of Hybrid IC's to the Automotive Electronics Market in Europe, Eckart von Roda
  Volume 8 (1981), Issue 1-2, Pages 67-76
• New Thick Film Functional Devices, Y. Taketa, O. Abe, and M. Haradome
  Volume 8 (1981), Issue 1-2, Pages 77-82
• Low-Value Nickel Resistors Electroless-Plated on “IMST” Substrate for Power Hybrid ICs, N. Miura, Y. Fuura, and A. Kazami
  Volume 8 (1981), Issue 1-2, Pages 83-89
• Multi-Layer 2 Mil Line Technology, Tamio Saito and Yoshikatsu Fukumoto
  Volume 8 (1981), Issue 1-2, Pages 91-98
• Photochemical Image Formation Process for High Density Printed Circuit Patterns, Katsuhiro Takahashi, Kunihiro Ikari, Jiro Kano, Tsutomu Takamura, Toshihiro Ueki, Tsuguo Yamaoka, and Takahiro Tsunoda
  Volume 8 (1981), Issue 1-2, Pages 99-102
• Development of Substrate Carrier System, N. Miura, Y. Fuura, and K. Uchida
  Volume 8 (1981), Issue 1-2, Pages 103-109
• Fabrication of Nonreciprocal Microwave Components Using Thick Film Ferrimagnetic Pastes, Chinmay. K. Maiti, D. Bhattacharyya, and N. B. Chakrabarti
  Volume 8 (1981), Issue 1-2, Pages 111-114
• Selective Glaze for Last Line Visible Thermal Head, Kaoru Hashimoto, Nobuo Kamehara, Minoru Terashima, and Koichi Niwa
  Volume 8 (1981), Issue 1-2, Pages 115-121
• Book Reviews
  Volume 8 (1981), Issue 1-2, Pages 123-124
• Conference Diary
  Volume 8 (1981), Issue 1-2, Pages 125-127
• Announcement
  Volume 8 (1981), Issue 1-2, Pages 128-128