IC-Quartz watches have been manufactured since the appearance of CMOS-LSI about seven years ago. Nowadays,
the outside view of the quartz watch is the same as that of a mechanical watch through minimizing electronic parts such
as battery, crystal oscillator, capacitor, and IC packaging volume. Recently, IC packaging technology for electronic
wrist watches (both the analog quartz watch and digital quartz watch) has made a step foward. In Japan, some watch
makers adopt a film carrier assembly technique for producing thin and low-priced watches. They are using 3 layers and
35 mm wide film which fits very well the substrate of the quartz watch, especially the digital quartz watch.The Citizen Watch Co., Ltd. started an investigation as to which method was suitable for IC package for watches in
1975 and adopted a flip chip technique as being the most suitable for analog quartz watches. The flip chip technique
will allow the fabrication of a very small and thin package. Important characteristics of the technique permit design
flexibility and high density packaging of the ICs. In this paper, a flip chip technique using a Printed Circuit Board as a
substrate is described.

Yoshio  Iinuma

IC Packaging Technology for Electronic Watches

A newly developed AVI transponder is to be used in Automatic Vehicle Identification (AVI) system, which provides
identification of moving vehicles passing by a certain location, as to its registration number, and classification etc. This
AVI system is characterized by the fact that it utilizes ceramic resonators in the composition of a transponder
identification code, and a single microwave carrier to convey an interrogation signal to, and a response signal from,
that transponder.The transponder is a completely passive device free of any power supply, and operates as a &#8220;Reflector&#8221;. Overall
external dimensions of transponder are 7 &#215; 10  &#215; 1 cm with a weight of 150 grams, the unit is compact, light weight
and can be mounted easily on the vehicle, and is easy to carry.All of the circuitry required for the transponder is provided in the form of microstrip lines utilizing MIC (Microwave
Integrated Circuit) technology on the PTFE-glass fibre laminate substrate. The transponder circuitry, which consists
of printed antenna, microwave modem circuit and medium frequency circuit, is patterned on both surfaces of the single
substrate. In this paper, operation principle, circuitry and construction of the transponder will be described.

Shoichi  Kamata

Yoshinori  Kimura

Johji  Sakuragi

AVI Transponder

In hybrid integrated circuit mask design, the design quality largely depends on the designer&#39;s experience and
creativity. It is difficult to completely automate the design process as is done with LSIs or printed circuit boards. It is
important to incorporate flexibility into the system.This paper describes an interactive design system for laying out hybrid ICs. The system is implemented on a large
host computer, and graphic display terminals are connected to it in a time sharing environment. The system provides
designers with many interactive facilities which are useful in designing hybrid ICs. In addition to highly interactive
dialogue, the system has capabilities such as dynamic checking of the designer&#39;s operations against a set of design
rules, or automatic generation of standardized element patterns.The system outputs mask information, design documents and so on which are used in the CAM of hybrid ICs. The
system is being used at Fujitsu and is contributing to high reliability of the design, and shortening the design period.

Hiroshi  Shiraishi

Kaoru  Kawamura

Masaaki  Hayashi

An Interactive Design System for Hybrid ICs

W.  Kinsner

A Theory of Bubbles in Ion-implanted Structures

An electron beam was used to create thin polysiloxane films from methylphenylsiloxane and the anomalous properties
of permittivity and temperature dependence, the resistivity dependence on humidity and the permittivity dependence
on pressure of air or argon, was examined. These anomalous properties can be potentially applicable to humidity
probes, pressure gauges and for miniature capacitors.

Vladim&#237;r  Ry&#353;anek

The Anomalous Properties of Polysiloxane Films

B. S. Joll

A Stand-Alone Magnetic Bubble Memory

The degradation mechanism of ruthenium-based thick film resistors is investigated in accelerated tests under various
conditions of humidity, temperature and overload stress. This study shows that the variation of resistance is mainly
caused by hydration and dehydration in the conductive component <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:msub><mml:mrow><mml:mtext>RuO</mml:mtext></mml:mrow><mml:mn>2</mml:mn></mml:msub><mml:mo>:</mml:mo><mml:mtext>&#x2009;</mml:mtext><mml:msub><mml:mrow><mml:mtext>RuO</mml:mtext></mml:mrow><mml:mn>2</mml:mn></mml:msub><mml:mo>+</mml:mo><mml:msub><mml:mrow><mml:mtext>xH</mml:mtext></mml:mrow><mml:mn>2</mml:mn></mml:msub><mml:mtext>O</mml:mtext><mml:mo>&#x2194;</mml:mo><mml:msub><mml:mrow><mml:mtext>RuO</mml:mtext></mml:mrow><mml:mn>2</mml:mn></mml:msub><mml:mtext>&#x2009;</mml:mtext><mml:mo>&#x2022;</mml:mo><mml:mtext>&#x2009;</mml:mtext><mml:msub><mml:mrow><mml:mtext>xH</mml:mtext></mml:mrow><mml:mn>2</mml:mn></mml:msub><mml:mtext>O</mml:mtext></mml:mrow></mml:math>. In
addition to measuring resistance, the Third Harmonic Index (THI) is studied as the characteristic which may indicate
the degree of various defects in resistors. A strong correlation exists between &#8220;the initial THI&#8221; and &#8220;the variation
rate of resistance during an accelerated test&#8221;. A resistor which indicates a quite large initial THI shows remarkable
variation of resistance, and has scratches and/or foreign substances on the surface of the thick film resistor. As a
result, it becomes evident that the initial THI can be used to predict the stability of a resistor in a nondestructive test.

Susumu  Kasukabe

Minoru  Tanaka

Reliability Evaluation of Thick Film Resistors Through Measurement
of Third Harmonic Index

Presented in this paper is a realization of Multi-Layer Substrate with 30 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mi>&#x03BC;</mml:mi></mml:math>m signal pattern width and 100 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mi>&#x03BC;</mml:mi></mml:math>m square
via holes on a 100 mm square ceramic substrate. To obtain this fine signal pattern width, a thin film technique, &#8220;GSP&#8221;
process, has been applied on a thick film dielectric layer. For the 100 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mi>&#x03BC;</mml:mi></mml:math>m square via holes through the thick film
dielectric, a new thick film technique, &#8220;DD&#8221; process, has been developed utilizing a photolithographic technique. This
paper describes the processes and the results obtained by the method.

Takashi  Tamura

Akihiro  Dohya

Tatsuo  Inoue

Combination of Thick-Film Dielectric/Thin Film Conductor for Fine
Pattern Formation of Multi-Layer Substrate

This paper discusses the status of thick conductive films formed by firing in air. The metals under study include nickel,
chromium, aluminum and copper. The properties of the films are presented for firing temperatures ranging from 580
to 850 degrees C. Compatibility with various dielectrics and glasses have been studied. Multilayer wiring seems
promising. Potential uses on porcelain enamelled steel, window glass and alumina substrates seem feasible.Initial studies have been made of compatibility with thick film ruthenium-based resistors. Some preliminary
information on termination resistance and other properties observed in such combinations is presented.Possible applications in gas discharge displays for cathodes and conductor runs are discussed. Potential uses may
include economical ground planes, solar cell electrodes, varistor and thermistor terminations, and resistance
thermometers.

S. J. Stein

C.  Huang

L.  Cang

Possibilities for Air Fireable Base Metal Conductors

In the course of the development of hybrid voltage regulators for automobile use, increasing the reverse blocking
voltage with decreasing of saturation voltage for output power darlington transistors, the capability of monolithic IC
chip against surge pulses generated in cars, and an improvement of the pattern design of thick film in order to
withstand temperature cycling, have been important subjects. Power darlingtons have more than 150 V of reverse
voltage as well as large secondary breakdown capacity and less than 1.2 V of saturation voltage. A monolithic chip
having small saturation voltage and more than 500 mA of surge current capability, has been developed. A
neck-shaped thick film pattern was developed to make soldering in a controlled manner. The problems in the earlier
stage with surge current and temperature cycling have been almost solved by these improvements.In this paper the characteristics of the transistor and the monolithic chip the structure of the device and related
problems observed in temperature cycling are described.

Akihiro  Sawamura

Tadashi  Takahashi

Sei-Ichi  Denda

Hybrid Voltage Regulator for Automobiles

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Active and Passive Electronic Components provides a forum for the science and technology of all types of electronic components, and publishes experimental and theoretical papers on topics such as transistors, hybrid circuits and sensors.

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