This paper discusses the status of thick conductive films formed by firing in air. The metals under study include nickel,
chromium, aluminum and copper. The properties of the films are presented for firing temperatures ranging from 580
to 850 degrees C. Compatibility with various dielectrics and glasses have been studied. Multilayer wiring seems
promising. Potential uses on porcelain enamelled steel, window glass and alumina substrates seem feasible.Initial studies have been made of compatibility with thick film ruthenium-based resistors. Some preliminary
information on termination resistance and other properties observed in such combinations is presented.Possible applications in gas discharge displays for cathodes and conductor runs are discussed. Potential uses may
include economical ground planes, solar cell electrodes, varistor and thermistor terminations, and resistance
thermometers.

S. J. Stein

C.  Huang

L.  Cang

Possibilities for Air Fireable Base Metal Conductors

In the course of the development of hybrid voltage regulators for automobile use, increasing the reverse blocking
voltage with decreasing of saturation voltage for output power darlington transistors, the capability of monolithic IC
chip against surge pulses generated in cars, and an improvement of the pattern design of thick film in order to
withstand temperature cycling, have been important subjects. Power darlingtons have more than 150 V of reverse
voltage as well as large secondary breakdown capacity and less than 1.2 V of saturation voltage. A monolithic chip
having small saturation voltage and more than 500 mA of surge current capability, has been developed. A
neck-shaped thick film pattern was developed to make soldering in a controlled manner. The problems in the earlier
stage with surge current and temperature cycling have been almost solved by these improvements.In this paper the characteristics of the transistor and the monolithic chip the structure of the device and related
problems observed in temperature cycling are described.

Akihiro  Sawamura

Tadashi  Takahashi

Sei-Ichi  Denda

Hybrid Voltage Regulator for Automobiles

D. S. Campbell

Editorial

The causes of failure mechanisms of multilayer ceramic capacitors that result in zero resistance (shorts) or low
resistance (high leakage) behaviour in the capacitors when the capacitors are subjected to low voltages have been
studied. It has been found that failures resulted from the electrochemical reaction of electrode materials in the
microscopic open pores which pass across a ceramic layer between inner electrodes and are filled with water
containing Cl&#8722; ions. The mechanism found in this investigation has been applied to enable screening processes to be
evolved for manufactured capacitors to eliminate the possibility of failure and hence to improve the reliability of
circuits using multilayer ceramic capacitors.

Hirofumi  Ikeo

Sanpei  Sakamoto

Ken  Sato

Hisakazu  Nishiura

Katsuhiro  Ohno

Failure Mechanisms That Cause High Electrical Leakage in Multilayer
Ceramic Capacitors

Polyimide resin of solvent-soluble type, which is called “X-resin” in short, was discovered lately. It is soluble in
dimethylacetoamid (DMAc), and new extensive applications are expected.Some physical, chemical and electrical characteristics are studied from the viewpoint of polymer material for hybrid
application. Particularly comparison of the characteristics of X-resin specimens before and after long term exposure
to humid and hot environments were made, remembering that electronic devices often operate under such conditions
in Japan.From the results obtained up to now, no conspicuous difference seems to exist between the characteristics of X-resin
and those of the conventional (i.e., solvent-insoluble) resins, as published in various literature. It should be noted,
however, that some unusual effects, i.e., the remarkable increase in surface resistivity σ, the evident decrease in tan <mml:math id="E1" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mi>δ</mml:mi></mml:math>,
etc., were found in X-resin specimens after going through the above-mentioned damp-hot test. All those effects are
contrary to the usual concepts of deterioration of polymer materials, but are rather advantageous for hybrid
application. It is also worth noticing that silver migration into X-resin seems scarcely to occur.Furthermore, new prospective uses of X-resin for printed wiring boards, packaging materials, binder for paste
materials, etc., are investigated.

Eiki Watanabe

Kyoichi Kanou

Tadashi Kubota

Fundamental Characteristics of Solvent–Soluble Polyimide Resin as a
Polymer for Hybrid Applications

K.  Kawabata

T.  Muto

Electrical Properties of Titanium Nitride Thin Films Deposited by Reactive Sputtering

Many recommendations have been made on the proper operating conditions for the laser trimming process. In
general these recommendations have centered on accuracy, precision or throughput. In some instances, these have
appeared to be mutually exclusive. If one wanted accuracy and precision, one had to sacrifice trimming speed and,
therefore, throughput.It has been reported that 40&#37; of the processing cost of a thick film resistor network is due to laser trimming. To
continue to make these networks commercially attractive, the manufacturers of laser trimming systems have addressed
themselves to the problem of providing suitable cuts at higher and higher trimming speeds.It is important for the user of such a system to understand the basics of the trimming process and to have an
appreciation for the new factors which will affect the performance characteristics of laser trimmed thick film resistors.
This paper summarizes the previous work as it relates to present technology. It then attempts to develop new
guidelines for high speed laser trimming.

Ren&#233; E. Cot&#233;

The Effect of High Speed Laser Trimming on Accuracy and Stability
of Thick Film Resistors

Thick film circuits were developed for temperature compensating of semiconductor strain gauges and for connecting
the gauges to amplifiers in electronic pressure and differential pressure transmitters. In each circuit, ten Au pads for
Al wire bonding and thirteen Ag/Pd pads for soldering must be fabricated on a small substrate. The results of the
research are shown below.(1) The resistance values and the thermistor constants required for the thermistors are 0.9 &#177; 0.09 kilo-ohm and
2500 &#177; 40 Kelvin, respectively. Those characteristics are realized by developing a paste composition composed of a
new spinel type oxide (Mn1.6Co0.8Ni0.35Ru0.25O4) RuO2 and glass.(2) Accelerated life tests of the thick film thermistors reveal that the resistance drift rates of the thermistors are less
than &#177;0.02 &#37;/year at 120&#176;C.(3) Life tests clarify that the wire bonding pads fabricated by using ESL 8882 Au paste keep more than 4 grams in
pull strength, and that the soldering pads fabricated by using Sumitomo CLP 495A Ag/Pd paste are more than 1
kilo-gram in pull strength.(4) The temperature dependence of zero shift and span shift in the pressure transmitter are suppresed within &#177;0.2%
between &#8211;40&#176;C and 120&#176;C by using the thick film circuit developed.

Hideo  Arima

Akira  Ikegami

Hiromi  Tosaki

Mitsuo  Ai

Yoshitaka  Matsuoka

Tsutomu  Okayama

Thick Film Temperature Compensating Circuit for Semiconductor Strain
Gauges

The electronics industry has become interested in a thick film materials system based on copper for both technical and
economic reasons. Copper conductors offer excellent conductivity, solderability, and solder leach resistance as well as
lower intrinsic metal cost and price stability.Significant adoption of copper in thick film applications requires a complete system of materials for the designer and
manufacturer to choose from and sufficient processing information to assist the industry to get started. Industry has
begun the adoption of copper in selected applications. Design of new applications and experience in processing will
move this technology forward in the industry.Du Pont has developed a copper materials system which includes copper conductor compositions, low K dielectric
and compatible resistor compositions. The compositions are screen printed, dried in an air atmosphere at 120&#8451; for
ten minutes and fired in a nitrogen atmosphere to a peak temperature of 900&#8451;. All materials in the copper system
may be processed in commercially available atmosphere conveyor furnaces using commercial nitrogen.The copper compositions provide high adhesion conductors with resistivity values in the range of one to two
milliohms per square. They can be used to make multilayer interconnect structures, microwave circuits, and as a
replacement for Mo-Mn metallizing. In addition, copper may be used as the conductor on porcelain-enamelled steel
substrates. The dielectric composition provides a dense film with a dielectric constant of about eight which can be used
With copper to make multilayer interconnect structures. The resistor compositions produce resistors with temperature
coefficient of resistance (TCR) less than 150 ppm per &#8451; and are useful for resistor networks and hybrid microcircuits.

J. D. Mitchell

P. C. Donohue

C. R. Needes

R. E. Funer

R. O. Uhler

Copper Materials System for Microcircuitry: A Status Report

Electronic circuits for industrial uses must satisfy the following requirements: low sensitivity to changes in the
surrounding temperature, high reliability, and small size. In the amplifier for a pressure transmitter described here, the
temperature dependences of its properties, Zero point and Span, are intensively influenced by TCRs of the resistors
used, and by a mismatching of the temperature dependences of the off-set voltages between the two operational
amplifier IC chips. As forthe thick film resistors, it has been cleared that the DuPont 1700 series resistor pastes are
the most suitable:TCRs of less than +80 ppm/&#176;C can be attained, and the change in resistance of the overglazed and
laser trimmed resistors is less than +0.1&#37; after 5000 hours at 200&#176;C. As for the operational amplifier IC chips, their
temperature dependences of the off-set voltages are checked individually, utilizing a ceramic carrier containing an
operational amplifier IC chip. Then a pair of ceramic carriers, with a minimum mismatching of their temperature
dependences, is mounted on a thick film circuit substrate by a Pb/Sn solder reflowing. The various transistor chips are
divided into three functional blocks, and bonded into three ceramic carriers. Utilization of ceramic carriers in all active
devices employed results in sufficient standardization in the characterization of the semiconductor devices and in the
hybridizing process.In the thick film hybrid IC amplifier for a pressure transmitter thus developed, the temperature dependences of
Zero point and Span are less than &#8211;0.5&#37; FS/100&#176;C, respectively. The drifts of Zero point and Span are less than
&#177;0.1&#37; FS in the period of 3000 hours of an operating test with DC 24 V loading at 100&#176;C.

A Thick Film Hybrid IC Amplifier for Industrial Use

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Active and Passive Electronic Components provides a forum for the science and technology of all types of electronic components, and publishes experimental and theoretical papers on topics such as transistors, hybrid circuits and sensors.

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Active and Passive Electronic Components

International Microelectronics Conference. Part II

International Microelectronics Conference. Part II

Articles

Possibilities for Air Fireable Base Metal Conductors

Hybrid Voltage Regulator for Automobiles

Editorial

Failure Mechanisms That Cause High Electrical Leakage in Multilayer Ceramic Capacitors

Fundamental Characteristics of Solvent–Soluble Polyimide Resin as a Polymer for Hybrid Applications

Electrical Properties of Titanium Nitride Thin Films Deposited by Reactive Sputtering

The Effect of High Speed Laser Trimming on Accuracy and Stability of Thick Film Resistors

Thick Film Temperature Compensating Circuit for Semiconductor Strain Gauges

Copper Materials System for Microcircuitry: A Status Report

A Thick Film Hybrid IC Amplifier for Industrial Use