The use of thick film passive networks and hybrid integrated circuits by the Bell System is described in this paper.
Included is a discussion of how attributes of thick films such as a large resistance range, high power handling
capability, a bipolar capacitor and multilevel interconnection capability are used to provide a range of circuit
properties that supplement the properties available in a well-established thin film technology. Design aids permitting
a rapid transition from an electrical schematic to a finished circuit, special laser trimming procedures and material
blending procedures are described for resistor networks. Also included are assembly and packaging techniques
suitable for high reliability and low cost manufacturing. Several hybrid integrated circuits which benefit from the use
of thick films are described in terms of their particular electrical or structural requirements. Included is a family of
power converter circuits illustrating the advantages of a modular approach to circuit design in which functional
resistor trimming provides a number of different circuit characteristics. Several applications involving the use of thick
films in combination with thin films to provide special hybrid circuit properties not available from thin films alone are
described. These and other possible uses of the two technologies in the same circuit are discussed in terms of
combining the best properties of each technology to provide higher reliability and lower circuit cost. Finally, the
future for the use of thick films in the Bell System is discussed.

William B. Grupen

Howard M. Cohen

Thick Film Circuits for Telecommunications Equipment

A new type of film driver (NFD) has been developed using thin film integrated circuits technologies. The realized
driver was one-tenth as small as that of a conventional driver in volume. The NFD has employed the tantalum nitride
(Ta2N) thin film resistors with low TCR values in order to achieve high accuracy. The NFD was housed in a
hermetically-sealed metal case with a size of 39 &#215; 26 &#215; 6 mm. Resistors of NFD circuits were adjusted by laser
trimming. DC levels of the transistor circuits, were adjusted by functional laser trimming. When the developed NFD is
operated at medium output voltage of 4 Vp-p for 5 years at circumstance temperature of 40&#8451;, the resistance change
of the resistors which control the accuracy of the output voltage is predicted to be less than 0.05&#37;, which corresponds
to the drift of the output level within 2 mV.

Masato  Murata

Shohei  Akitake

Hitoshi  Yamaguchi

Hajime  Sasaki

Shiro  Otani

A New Type of Film Driver

The development of thick-film functional devices having oscillation, negative resistance, switching, memory and so on
has been needed.New non-volatile memory devices manufactured of Nb2O5-based thick-film have now been created. The thick-film
devices have been prepared by using common thick-film technology such as screen printing, drying and firing. The
characteristics and the operation of the devices are as follows:When a dc voltage is applied to the devices, rapid resistance change, so called switching effect, occurs. The devices
have low resistance state. Even when the voltage is removed completely, the devices do not return to high resistance
state and keep low resistance state. However, when alternating voltage is impressed upon the devices, the low
resistance state goes to the high resistance state. The recovery time of the resistance state depends upon the frequency
of applied ac voltage. The higher frequency voltage that is applied, the sooner the recovery time becomes. The
threshold voltage exponentially increases with higher frequency of an applied ac voltage.In addition to the memory effect, the Nb2O5-based thick-film devices have a switching and oscillation characteristic.

Y.  Taketa

O.  Abe

M.  Haradome

New Thick Film Functional Devices

A thermal head in which the last line is visible allows characters to be viewed as soon as they are printed. The thermal
head is constructed with a selective glazed layer and heat sources, which are formed at the edge of a ceramic
substrate. The selective glazed layer must be smooth and flat, even at the edge, for heat sources to be formed on it.
Selective glaze characteristics were studied using PbO-B2O3-SiO2 and B2O3-SiO2 glazing materials to realize the last
line visible thermal head. Several commercially available gold conductors were screen printed on fine grained alumina
substrates. Wettability, levelling characteristics and flatness at the edge of the selective glaze on each gold conductor
were examined. Dependence of their characteristics on firing conditions were also examined. A combination of
PbO-B2O3-SiO2 glass and fritless gold conductor provides a smooth and flat glaze surface even at the edge, and experimental results show that PbO-B2O3-SiO2 glazing material has the most suitable characteristics for a last line
visible thermal head. A last line visible thermal head was formed using PbO-B2O3-SiO2 glazing material. The selective
glazed layer was formed over the thick film circuits of gold for the power supply, which were screen printed on a fine
grained alumina substrate. Ta2N thin film for resistive heat sources was formed at the edge of the glazed layer. The
thermal head provides good print quality and can print 20 characters/line at 5 lines/sec with a resolution of
2.7 dots/mm.

Kaoru  Hashimoto

Nobuo  Kamehara

Minoru  Terashima

Koichi  Niwa

Selective Glaze for Last Line Visible Thermal Head

A series of air-firing base metal resistor pastes which yield resistors with properties comparable to those of conventional
precious metal thick film resistors has been developed. The pastes can be post-fired or co-fired with air-firing
nickel conductors in a very fast firing cycle thus providing a base metal combination which can be processed using
conventional furnaces. This is concluded to be a significant contribution to the manufacture of thick film circuits of low
cost especially in view of recent large increases in the prices of precious metals.

E. K. Browne

B.  Walton

An Air Firing Base Metal Resistor and Conductor System for Low Cost
Thick Film Circuit Manufacture

This paper describes a new resistor formation technique, characterized by the use of our unique hybrid IC substrate
(IMST substrate) and the electroless nickel plating on it.The evaluation of various electroless nickel plating baths to deposit nickel alloy with a different composition for
each is included. The resistor properties of the nickel film from a selected bath are showed. The plating conditions
affecting the resistance are discussed. Finally, the application to the built-in emitter resistors of the IMST audio power
hybrid IC is presented.

N.  Miura

Y.  Fuura

A.  Kazami

Low-Value Nickel Resistors Electroless-Plated on &#8220;IMST&#8221; Substrate
for Power Hybrid ICs

In the last few years hybrids have been increasingly used in automotive electronics in Europe. With examples from the
BOSCH and BLAUPUNKT production range their application in regulators, breakerless ignition modules,
electronically-controlled fuel injection systems and car radios is illustrated. The elements and techniques used to
assemble the hybrids, and the advantages which can be gained are discussed.

Eckart  von Roda

Application of Hybrid IC&#39;s to the Automotive Electronics Market in
Europe

This paper discusses the use of laser trim systems for the trimming of automotive hybrids. Being high volume parts
these devices are best trimmed in two stages; first, a passive trim of the resistor substrate and secondly, a functional
trim. The requirements for such a functional trim are such as to demand a fully integrated system.

Junji  Mitobe

Chris  Davison

Functional Laser Trimming of Automotive Electronics

High density packaging of semiconductor devices is necessary for high performance in compact electronic systems.
But the assembly technology must also remain cost attractive.Through the development efforts conducted during the past years in the world, the Tape Automated Bonding &#8211; 
TAB &#8211; has become the assembly technology allowing a very high density packaging. In combination with substrate
technology it has grown into a complete, cost effective, micropackaging concept.The paper describes the main technical characteristics of this packaging concept. Specific equipments for TAB
were designed and built by CII-Honeywell Bull for installation in the factory. These equipments are not only those,
directly related to the TAB technology processing steps but include also other equipments like high precision thick
film printer.The main features of the new micropackaging facility are also presented. Some examples of high density packages
built with tape automated bonding are described and some of the main quality and reliability aspects are discussed.

Karel  Kurzweil

Tape Automated Bonding for High Density Packaging

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Active and Passive Electronic Components provides a forum for the science and technology of all types of electronic components, and publishes experimental and theoretical papers on topics such as transistors, hybrid circuits and sensors.

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Active and Passive Electronic Components

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Active and Passive Electronic Components

International Microelectronics Conference. Part I

International Microelectronics Conference. Part I

Articles

Thick Film Circuits for Telecommunications Equipment

A New Type of Film Driver

New Thick Film Functional Devices

Selective Glaze for Last Line Visible Thermal Head

An Air Firing Base Metal Resistor and Conductor System for Low Cost Thick Film Circuit Manufacture

Low-Value Nickel Resistors Electroless-Plated on “IMST” Substrate for Power Hybrid ICs

Application of Hybrid IC's to the Automotive Electronics Market in Europe

Functional Laser Trimming of Automotive Electronics

Tape Automated Bonding for High Density Packaging