Editorial Board

• M. Ali, University of South Carolina, USA
• Charles Bunting, Oklahoma State University, USA
• Felipe Cátedra, Universidad de Alcalá, Spain
• Dau-Chyrh Chang, Oriental Institute of Technology, Taiwan
• Deb Chatterjee, University of Missouri Kansas City, USA
• Z. N. Chen, National University of Singapore, Singapore
• Michael Yan Wah Chia, Agency for Science, Technology and Research, Singapore
• Christos Christodoulou, University of New Mexico, USA
• Shyh-Jong Chung, National Chiao Tung University, Taiwan
• Lorenzo Crocco, Consiglio Nazionale delle Ricerche, Italy
• Tayeb A. Denidni, Institut National de la Recherche Scientifique, Canada
• Antonije R. Djordjevic, University of Belgrade, Serbia
• Karu P. Esselle, Macquarie University, Australia
• Francisco Falcone, Universidad Pública de Navarra, Spain
• Miguel Ferrando, Universidad Politécnica de Valencia, Spain
• Vincenzo Galdi, University of Sannio, Italy
• Wei Hong, Southeast University, China
• Hon Tat Hui, National University of Singapore, Singapore
• Tamer S. Ibrahim, University of Pittsburgh, USA
• Nemai Karmakar, Monash University, Australia
• Se-Yun Kim, Korea Institute of Science and Technology, Republic of Korea
• Ahmed A. Kishk, Concordia University, Canada
• Selvan T. Krishnasamy, SSN College of Engineering, India
• Tribikram Kundu, The University of Arizona, USA
• Byungje Lee, Kwangwoon University, Republic of Korea
• Ju-Hong Lee, National Taiwan University, Taiwan
• L. Li, National University of Singapore, Singapore
• Yilong Lu, Nanyang Technological University, Singapore
• Atsushi Mase, Kyushu University, Japan
• Andrea Massa, University of Trento, Italy
• Giuseppe Mazzarella, Università di Cagliari, Italy
• Derek McNamara, University of Ottawa, Canada
• Christoph F. Mecklenbräuker, Vienna University of Technology, Austria
• Michele Midrio, University of Udine, Italy
• Mark Mirotznik, University of Delaware, USA
• Ananda Sanagavarapu Mohan, University of Technology Sydney (UTS), Australia
• P. Mohanan, Cochin University of Science and Technology, India
• Pavel Nikitin, Intermec Technologies Corporation, USA
• Athanasios D. Panagopoulos, National Technical University of Athens, Greece
• Matteo Pastorino, University of Genoa, Italy
• Massimiliano Pieraccini, Università degli Studi di Firenze, Italy
• Sadasiva M. Rao, Auburn University, USA
• Sembiam R. Rengarajan, California State University, USA
• Ahmad Safaai-Jazi, Virginia Polytechnic Institute and State University, USA
• Safieddin Safavi-Naeini, University of Waterloo, Canada
• Magdalena Salazar-Palma, Universidad Carlos III de Madrid, Spain
• Stefano Selleri, University of Florence, Italy
• Zhongxiang Q. Shen, Nanyang Technological University, Singapore
• John J. Shynk, University of California, Santa Barbara, USA
• Mandeep Singh Jit Singh, Universiti Kebangsaan, Malaysia
• Seong-Youp Suh, Intel Corporation, USA
• Parveen Wahid, University of Central Florida, USA
• Yuanxun Ethan Wang, University of California, Los Angeles, USA
• Daniel S. Weile, University of Delaware, USA
• Tat Soon Yeo, National University of Singapore, Singapore
• Young Joong Yoon, Yonsei University, Korea
• Wenhua Yu, Pennsylvania State University, USA
• Jong-Won Yu, Korea Advanced Institute of Science and Technology, Republic of Korea
• Anping Zhao, Nokia Research Center, China