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VLSI Design
Volume 13 (2001), Issue 1-4, Pages 131-134

An Analytic Expression of Thermal Diffusion Coefficient for the Hydrodynamic Simulation of Semiconductor Devices

1Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, MA 01003, USA
2lBM SRDC East Fishkill Facility, Hopewell Junction, NY 12533, USA
3Stanford University, Stanford, CA 94305, USA

Copyright © 2001 Hindawi Publishing Corporation.


A new analytical expression of thermal diffusion coefficient DT is derived. To the firstorder approximation, it is given by (1+η)-1(D/Tn) rather than (1–η)(D/Tn) where η=–(Tn/η*)(η*/Tn ) and η* represents the temperature-dependent bulk mobility. This new transport coefficient is implemented in our 2-D hydrodynamic device simulator and it seems to produce more reasonable results.