Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology

<table class="table-group" width="800px"><tr class="fig-image" id="a"><td><img alt="675173.fig.001a" src="https://static.hindawi.com/articles/ape/volume-2008/675173/figures/675173.fig.001a.jpg"/></td></tr><tr class="fig-caption"><td align="center"><table><tr><td><b>(a) </b>Placement of the bumped flip chips on the flex,</td></tr></table></td></tr><tr class="fig-image" id="b"><td><img alt="675173.fig.001b" src="https://static.hindawi.com/articles/ape/volume-2008/675173/figures/675173.fig.001b.jpg"/></td></tr><tr class="fig-caption"><td align="center"><table><tr><td><b>(b) </b>Soldering on the flex substrate and underfill,</td></tr></table></td></tr><tr class="fig-image" id="c"><td><img alt="675173.fig.001c" src="https://static.hindawi.com/articles/ape/volume-2008/675173/figures/675173.fig.001c.jpg"/></td></tr><tr class="fig-caption"><td align="center"><table><tr><td><b>(c) </b>Die bond on the DBC with flex deformation (thin Cu
metallization) or die bond with preformed flex</td></tr></table></td></tr></table>

<table>Process flow of the flip chip technology. (Right figures: photographs showing the prototype during the
assembly process: (a) bumped MOSFET, (b) chips soldered to the flex, (c) complete
assembly).</table>

Advances in Power Electronics

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										Figure 1: Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology 