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ElectroComponent Science and Technology
Volume 4 (1977), Issue 3-4, Pages 117-124
http://dx.doi.org/10.1155/APEC.4.117

Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip

Ferranti Limited, Chadderton, UK

Received 5 March 1977

Copyright © 1977 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

B. C. Heap and S. A. France, “Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip,” ElectroComponent Science and Technology, vol. 4, no. 3-4, pp. 117-124, 1977. doi:10.1155/APEC.4.117