Laser-Induced Backside Wet Etching of Transparent Materials with Organic and Metallic Absorbers
Figure 3
Etch rate of fused silica with 248 nm excimer laser
pulses and a spot with size of . Comparison of H-LIBWE
with a 0.5 M py:toluene and M-LIBWE with gallium. (a) Etch rate depending
on the laser fluence. (b) Normalized etch rate depending on the pulse number.
