Laser-Induced Backside Wet Etching of Transparent Materials with Organic and Metallic Absorbers
Figure 4
Etch rates of fused silica for different liquids at
248 nm laser pulse irradiation. (a) Etch rate of fused silica for toluene
with and without solved pyrene and for halogenated benzenes (fluorine and
chlorine benzene) at 300 pulses. (b) Etch rate for fused silica at 30 pulses
using gallium and mercury as liquid metals.
