Laser Chemistry

Research Article

Laser-Induced Backside Wet Etching of Transparent Materials with Organic and Metallic Absorbers

Table 1

Main characteristics of the backside etching techniques with nanosecond laser pulses in comparison to laser ablation.
CharacteristicTechnique
H-LIBWEM-LIBWEAblation
Threshold fluenceLowHighHigh
Laser wavelengthUV/visUV-IRUV (IR)
Etch rateAverageHighHigh
Incubation effectsDistinctNoNoticeable
Etching qualityVery goodGoodAverage