International Journal of Microwave Science and Technology

Research Article

High-Frequency Properties of Embedded Passives and Thermal Resistance in Organic Substrates for RF Module

Figure 8

The substrate structures with various chip mounting, via-hole, and through-hole layout.
871027.fig.008a
(a)
871027.fig.008b
(b)
871027.fig.008c
(c)
871027.fig.008d
(d)
871027.fig.008e
(e)
871027.fig.008f
(f)