Research Article
A Numerical Formula for General Prediction of Interface Bonding between Alumina and Aluminum-Containing Alloys
Table 3
Binding energies of Al 2p in Ti-Al compounds prepared in various conditions compared to those in alumina on Cu and Ni related metals as references.
| | |
Preparation conditions | Binding energy (eV) |
Termination |
Reference | | | Al 2p3/2 or Al 2p
(ox) | Al 2p3/2 or Al 2p
(MAl) | Al 2p3/2 or Al 2p
(ox) − (MAl) |
| | Cu9Al(111) | | 74.90 | 72.58 | 2.32 | Al | [24] | | Cu(111) | | 74.11 | | 1.53 | O | [10] | | NiAl(110) | | 74.91 | 72.47 | 2.44 | Al | [10] | | Ni(111) | | 74.11 | | 1.64 | O | [10] |
| | TiAl(111) | 1 10−5 Pa, 923 K | 75.5 | 72.2 | 3.3 | | [25] | | Ti45-Al55 | 1 10−5 Pa, 923 K | 75.5 | 72.3 | 3.2 | | [26] | | Ti55-Al45 | <5 10−8 Pa, ~873 K | 74.9 | 71.6 | 3.3 | | [27] | | Ti3Al | 1 10−5 Pa, 923 K | 75.5 | 72.3 | 3.2 | | [26] | | TiAl | 1.3 10−5 Pa, 673–873 K | 74.4 | 71.7 | 2.7 | | [28] | | Ti45-Al55 | 10 Pa, 423 K & 623 K | 75.2 | 72.57 | 2.63 | | [29] | | TiAl | air, 573–673 K | 74.9 | 72.3 | 2.6 | | [30] |
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