International Journal of Metals

Research Article

Accumulative Roll Bonding of Pure Copper and IF Steel

Figure 5

SEM micrographs in TD plane of pure copper, (a) one, (b) two, (c) three, and (d) four passes of ARB, preheated at 400°C.
179723.fig.005a
(a)
179723.fig.005b
(b)
179723.fig.005c
(c)
179723.fig.005d
(d)