Travelling along the Clinical Roadmap: Developing Electrospun Scaffolds for Tendon Repair

<table>Polymer/solvent combinations for creating electrospun 3D bundles: poly(<i>ε</i>-caprolactone) PCL (acetone), PCL (1,1,1,3,3,3-hexafluoroisopropanol; HFIP), 50 : 50 blend of PCL and PLGA (poly(lactic-co-glycolic acid)) in HFIP, and PLGA (HFIP) demonstrating scaffold morphologies from scanning electron micrographs (scale bar 20 <i>μ</i>m), fibre diameter, and mechanical properties in terms of Young’s modulus and tensile strength (mean ± standard deviation).</table>

Conference Papers in Science

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Figure 2

Figure 2: Travelling along the Clinical Roadmap: Developing Electrospun Scaffolds for Tendon Repair 