Research Article
Effects of Hard Surface Grinding and Activation on Electroless-Nickel Plating on Cast Aluminium Alloy Substrates
Table 1
Plating chemicals and the mixing ratio.
| | Bath | Media | Concentration | Temperature range (°C) | Time (min) |
| | Rinsing | Water | — | 25–30 | 1 | | Emulsifying | Emulsifier | — | 60–65 | 1 | | Alkaline cleaning | Sodium hydroxide | 0.4 g/L | 60–70 | 1 | | Acid cleaning | Hydrochloric acid | 5 mL/L | 60–70 | 1 | | Surfactant | | 0.0~0.12 g/L | 85–95 | 0.5 | | Plating | Nickel chloride | 30 g/L* | 85–95 | 10 | | Sodium hypophosphite | 40 g/L* | | Sodium citrate | 25 g/L* | | Ammonium chloride | 50 g/L* | | PCl2 | 0.02 g/L | |
After plating | Potassium chromate | 15 g/L | 50–65 | 3 |
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According to WinowlinJappes 2004 [15].
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