Research Article
Finite Element Analysis of System-Level Electronic Packages for Space Applications
Table 1
Relevant thermomechanical material properties.
| Material | Thermal conductivity (W/m-K) | Specific heat (J/kgK) | Emissivity | Density (kg/m3) |
| FR4 | 0.27 | 915 | N/A | 1820 | Polystyrene insulation | 0.036 | 1200 | N/A | 30 | Aluminum | 177 | 875 | 0.1 | 2790 | White paint | 0.000017 | N/A | 0.99 | 801 | Plastic interconnects | 3.976 | 1500 | N/A | 1610 | Copper | 401 | 385 | 0.05 | 8933 | PVC plate | 0.19 | 900 | 0.85 | 527 |
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Emissivity not specified for materials with minimal thermal radiation.
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