Research Article
Experimental Studies on the Bonding Strength and Fracture Behavior of Incompatible Materials Bonded by Mechanical Adhesion in Multilayer Rotational Molding
Figure 12
Multilayer sample with an interlayer under peeling load and materials: PE-MD (translucent) + TPE-U (black); aimed interlayer thickness: 1.125 mm, processing temperature: 200°C, holding time: 900 s, and 50 vol.-% TPE-U in material mixture.