Review Article
Importance of Molds for Nanoimprint Lithography: Hard, Soft, and Hybrid Molds
Figure 3
Schematic diagram of how a particle (red dot) can cause the air bubble between the resist and the stamp. Red dashed box shows the void area between the resist and the mold, which creates unpatterned area due to the defects; (inset) utilization of ETFE soft mold to accommodate the presence of defects.