Fuzzy TOPSIS for Multiresponse Quality Problems in Wafer Fabrication Processes

Table 1

𝐿₁₈(2¹×3²) orthogonal table for control factors and levels.

Number	(A) Temperature	(B) Pressure	(C) Nitrogen flow	(D) Silane flow	(E) Setup time	(F) Cleaning method
1	𝑇0−25	𝑃0−200	𝑁0	𝑆0−100	𝑡0	None
2	𝑇0−25	𝑃0	𝑁0−150	𝑆0−50	𝑡0+8	CM2
3	𝑇0−25	𝑃0+200	𝑁0−75	𝑆0	𝑡0+16	CM3
4	𝑇0	𝑃0−200	𝑁0	𝑆0−50	𝑡0+8	CM3
5	𝑇0	𝑃0	𝑁0−150	𝑆0	𝑡0+16	None
6	𝑇0	𝑃0+200	𝑁0−75	𝑆0−100	𝑡0	CM2
7	𝑇0+25	𝑃0−200	𝑁0−150	𝑆0−100	𝑡0+16	CM3
8	𝑇0+25	𝑃0	𝑁0−75	𝑆0−50	𝑡0	None
9	𝑇0+25	𝑃0+200	𝑁0	𝑆0	𝑡0+8	CM2
10	𝑇0−25	𝑃0−200	𝑁0−75	𝑆0	𝑡0+8	None
11	𝑇0−25	𝑃0	𝑁0	𝑆0−100	𝑡0+16	CM2
12	𝑇0−25	𝑃0+200	𝑁0−150	𝑆0−50	𝑡0	CM3
13	𝑇0	𝑃0−200	𝑁0−150	𝑆0	𝑡0	CM2
14	𝑇0	𝑃0	𝑁0−75	𝑆0−100	𝑡0+8	CM3
15	𝑇0	𝑃0+200	𝑁0	𝑆0−50	𝑡0+16	None
16	𝑇0+25	𝑃0−200	𝑁0−75	𝑆0−50	𝑡0+16	CM2
17	𝑇0+25	𝑃0	𝑁0	𝑆0	𝑡0	CM3
18	𝑇0+25	𝑃0+200	𝑁0−150	𝑆0−100	𝑡0+8	None