Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology

Table 2

Summary of interconnect data

	FC–Flex
Diameter $d$	100 $\mu$m pad /$d$$\approx$ 125 $\mu$m (ball)
Height $h$	60 $\mu$m
Pitch $p$	200 $\mu$m
Ratio $r_A=A_s/A_{\text{chip}}(\epsilon =80\%)$	max. 20%
Material	Soft solder
- thermal conductivity	35–50 W/mK
- electrical conductivity	7–10 ${10}^6$/Ωm
Average thermal conductivity ${\lambda }_{\text{av}}$	max. 7–10 W/mK
Average electrical conductivity ${\sigma }_{\text{av}}$	max 1.5–2 10^6/Ωm
Metallization layer	50–150 $\mu$m Cu