On-Chip Bondwire Magnetics with Ferrite-Epoxy Glob Coating for Power Systems on Chip

<table>Comparison of <math id="M62" xmlns="http://www.w3.org/1998/Math/MathML"><mrow><mi>Q</mi></mrow></math> factors between the state-of-the-art
MEMS micro-inductors, commercial wire wound inductors,
and the bondwire inductors.</table>

Advances in Power Electronics

fig13

Figure 13

Figure 13: On-Chip Bondwire Magnetics with Ferrite-Epoxy Glob Coating for Power Systems on Chip 