On-Chip Bondwire Magnetics with Ferrite-Epoxy Glob Coating for Power Systems on Chip

<table>Coupling coefficient <math id="M48" xmlns="http://www.w3.org/1998/Math/MathML"><mrow><mi>k</mi></mrow></math> for variable bonding spacing.</table>

Advances in Power Electronics

fig8

Figure 8

Figure 8: On-Chip Bondwire Magnetics with Ferrite-Epoxy Glob Coating for Power Systems on Chip 