Table of Contents
Indian Journal of Materials Science
Volume 2013 (2013), Article ID 725975, 6 pages
http://dx.doi.org/10.1155/2013/725975
Research Article

Structure and Thermal Stability of Copper Nitride Thin Films

1State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, China
2School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China

Received 26 June 2013; Accepted 4 August 2013

Academic Editors: Y. Habibi and A. Sotelo

Copyright © 2013 Guangan Zhang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Copper nitride (Cu3N) thin films were deposited on glass via DC reactive magnetron sputtering at various N2 flow rates and partial pressures with 150°C substrate temperature. X-ray diffraction and scanning electron microscopy were used to characterize the microstructure and morphology. The results show that the films are composed of Cu3N crystallites with anti-ReO3 structure. The microstructure and morphology of the Cu3N film strongly depend on the N2 flow rate and partial pressure. The cross-sectional micrograph of the film shows typical columnar, compact structure. The thermal stabilities of the films were investigated using vacuum annealing under different temperature. The results show that the introducing of argon in the sputtering process decreases the thermal stability of the films.