Table of Contents
Indian Journal of Materials Science
Volume 2013, Article ID 725975, 6 pages
Research Article

Structure and Thermal Stability of Copper Nitride Thin Films

1State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, China
2School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China

Received 26 June 2013; Accepted 4 August 2013

Academic Editors: Y. Habibi and A. Sotelo

Copyright © 2013 Guangan Zhang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Guangan Zhang, Zhibin Lu, Jibin Pu, Guizhi Wu, and Kaiyuan Wang, “Structure and Thermal Stability of Copper Nitride Thin Films,” Indian Journal of Materials Science, vol. 2013, Article ID 725975, 6 pages, 2013.