Table of Contents
Indian Journal of Materials Science
Volume 2016, Article ID 7419584, 4 pages
Research Article

Process to Improve the Adherences of Copper to a PTFE Plate

Electronics Department, Instituto Nacional de Astrofísica, Óptica y Electrónica, San Andrés Cholula, PUE, Mexico

Received 19 May 2016; Revised 24 July 2016; Accepted 4 August 2016

Academic Editor: Debdulal Das

Copyright © 2016 Abel Pérez et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


A simple low plasma power and roughness free process for improving the adherence of Cu to PTFE is presented. The results show that low pressure and Ar flow combination are the drivers of this improved adherence. Copper Peel Strength Tensile values up to 60 kg/m are obtained which are comparable to those shown in commercial composite dielectrics for high-frequency applications Printed Circuit Boards.