Table of Contents
International Journal of Microwave Science and Technology
Volume 2007, Article ID 41951, 5 pages
Research Article

Characteristic Impedance of a Microstrip-Like Interconnect Line in Presence of Ground Plane Aperture

1Jaypee University of Information Technology, Waknaghat, Solan 173215, India
2Embedded Systems Innovation Lab, Tata Consultancy Services, Bangalore 560066, India
3Jaypee Institute of Information Technology, Noida 201307, India

Received 9 May 2007; Revised 27 August 2007; Accepted 17 December 2007

Academic Editor: Chang-Ho Lee

Copyright © 2007 Rohit Sharma et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


We propose new empirical expressions for the characteristic impedance of a microstrip-like interconnect line in presence of ground plane aperture. The existing characteristic impedance expressions are modified so as to include the effect of the ground plane aperture. The variation in the characteristic impedance vis-à-vis the aperture size is established. The proposed expressions are general and valid for a range of dielectric materials concerning MICs, RFICs, and PCBs. The results are validated by measurements performed on a vector network analyzer.