“RF-SoC”: Integration Trends of On-Chip CMOS Power Amplifier: Benefits of External PA versus Integrated PA for Portable Wireless Communications

Figure 1

Block diagram of a single-chip direct-conversion BiCMOS DECT transceiver. Note that only the PA, antenna switch, some bypass capacitors, resistors, and filters are external to the chip. Adapted from Eynde et al. [1].