A New Process for On-Chip Inductors with High Q-Factor Performance
Figure 1
(a) Octogonal inductor layout, symmetrical design with windings in metal 3 and crossing sections in metal 2, outer diameter 213 m, and inductance nH. (b) Open structure for deembedding the pad and contact line capacities. (c) THRU structure for deembedding the contact line inductance and resistance.
