Table of Contents
International Journal of Microwave Science and Technology
Volume 2010 (2010), Article ID 871027, 5 pages
http://dx.doi.org/10.1155/2010/871027
Research Article

High-Frequency Properties of Embedded Passives and Thermal Resistance in Organic Substrates for RF Module

1Tsukuba Research Laboratory, Hitachi Chemical Co., Ltd., 1500 Ogawa, Chikusei-shi, Ibaraki 308-8521, Japan
2Central Research Laboratory, Hitachi Ltd., 1-280 Higashikoigakubo, Kokubunji-shi, Tokyo 185-8601, Japan

Received 30 October 2009; Accepted 8 February 2010

Academic Editor: Marc J. Franco

Copyright © 2010 Yusuke Kondo et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Linked References

  1. H. Ronkainen, T. Riihisaari, and H. Kattelus, “Passive integration process for RF multi-technology module,” in Proceedings of the IPC Printed Circuits EXPO, pp. 1–6, 2001, S-08-4.
  2. S. Donnay, P. Pieters, K. Vaesen et al., “Chip-package codesign of a low-power 5-GHz RF front end,” Proceedings of the IEEE, vol. 88, no. 10, pp. 1583–1597, 2000. View at Google Scholar · View at Scopus
  3. H. Kattelus, H. Ronkainen, and T. Riihisaari, “Passive integration process on standard and high resistivity silicon,” International Journal of Microcircuits and Electronic Packaging, vol. 22, no. 3, pp. 254–261, 1999. View at Google Scholar · View at Scopus
  4. R. T. Anderson and B. Beker, “Electrical characteristics of planar spiral inductors,” in Proceedings of the Electronic Components and Technology Conference (ECTC '99), pp. 82–87, San Diego, Calif, USA, 1999.
  5. S. Dalmia, W. Kim, S. H. Min et al., “Design of embedded high Q-inductors in MCM-L technology,” in Proceedings of the IEEE MTT-S International Microwave Symposium Digest, vol. 3, pp. 1735–1738, 2001.
  6. B. C. Kim and H.-H. Choi, “A new test method for embedded passives in high density package substrates,” in Proceedings of the Electronic Components and Technology Conference, pp. 1362–1366, Orlando, Fla, USA, 2001.
  7. S. O. Reilly, M. Duffy, S. C. O. Mathuna, and S. Payne, “Routes to embedded inductors in MCM-L technology—design, CAD and manufacturing issues,” in Proceedings of the International Symposium on Microelectronics, vol. 3582 of Proceedings of SPIE, pp. 435–440, San Diego, Calif, USA, November 1998.
  8. P. Chahal, A. Haridass, A. Pham et al., “Integration of thin film passive circuits using high/low dielectric constant materials,” in Proceedings of the Electronic Components and Technology Conference, pp. 739–744, San Jose, Calif, USA, 1997.
  9. P. Bowles and R. Charbonneau, “An overview of the NCMS/StorageTek embedded decoupling capacitance project,” in Proceedings of the International Symposium on Advanced Packaging Materials, pp. 191–196, Braselton, GA, USA, 1999.
  10. A. Okubora, T. Ogawa, T. Hirabayashi et al., “A novel integrated passive substrate fabricated directly on an organic laminate for RF applications,” in Proceedings of the Electronic Components and Technology Conference, pp. 672–675, 2002.
  11. Y. Hara, Y. Yamashiki, M. Kawasaki et al., “Development of high-K inorganic/organic composite material for embedded capacitors,” Journal of Japan Institute of Electronics Packaging, vol. 8, no. 7, pp. 573–579, 2005. View at Google Scholar · View at Scopus
  12. H.-W. You, S.-H. Kim, and J.-H. Koh, “Simulation and fabrication of embedded capacitors in the multilayer printed circuit board,” Japanese Journal of Applied Physics, vol. 47, no. 9, pp. 7707–7710, 2008. View at Publisher · View at Google Scholar · View at Scopus