Table of Contents
International Journal of Plasma Science and Engineering
Volume 2008 (2008), Article ID 154035, 5 pages
http://dx.doi.org/10.1155/2008/154035
Research Article

Etch Defect Characterization and Reduction in Hard-Mask-Based Al Interconnect Etching

Advanced Module Process Development Division, Technology Development Center, Macronix International Company, Ltd., (MD420) No.16, Li-Hsin Road, Science-Based Industrial Park, Hsinchu 300, Taiwan

Received 23 June 2008; Accepted 26 August 2008

Academic Editor: Jong-Shinn Wu

Copyright © 2008 Hong-Ji Lee et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Hong-Ji Lee, Che-Lun Hung, Chia-Hao Leng, et al., “Etch Defect Characterization and Reduction in Hard-Mask-Based Al Interconnect Etching,” International Journal of Plasma Science and Engineering, vol. 2008, Article ID 154035, 5 pages, 2008. doi:10.1155/2008/154035