Table of Contents
International Journal of Plasma Science and Engineering
Volume 2008 (2008), Article ID 371812, 5 pages
http://dx.doi.org/10.1155/2008/371812
Research Article

Microstructures Formation by Fluorocarbon Barrel Plasma Etching

1Silicon Technology Unit. 2, Boulevard Frantz Fanon, BP 140 Alger-7 merveilles, Algiers 16200, Algeria
2Advanced Technologies Development Centre, cité 20 Aout 1956, BP 17, Baba Hassen, Algiers, Algeria

Received 27 March 2007; Revised 7 August 2007; Accepted 17 September 2007

Academic Editor: Rami A. Kishek

Copyright © 2008 A. El amrani et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Linked References

  1. A. R. Burgers, R. Kinderman, J. D. Hylton, W. C. Sinke, and H. H. C. de Moor, “Light-trapping in saw-damage etched silicon wafers,” in Proceedings of the 14th European Photovoltaic Solar Energy Conference Exhibition (EPVSEC '97), pp. 143–145, Barcelona, Spain, June-July 1997.
  2. D. S. Ruby, S. H. Zaidi, and S. Narayanan, “Plasma-texturization for multicrystalline silicon solar cells,” in Proceedings of the 28th IEEE Photovoltaic Specialists Conference (PVSC '00), pp. 75–78, Anchorage, Alaska, USA, September 2000. View at Publisher · View at Google Scholar
  3. C. Wu, C. H. Crouch, and L. Zhao et al., “Near-unity below-band-gap absorption by microstructured silicon,” Applied Physics Letters, vol. 78, no. 13, pp. 1850–1852, 2001. View at Publisher · View at Google Scholar
  4. J. D. Hylton, A. R. Burgers, and W. C. Sinke, “Alkaline etching for reflectance reduction in multicrystalline silicon solar cells,” Journal of the Electrochemical Society, vol. 151, no. 6, pp. G408–G427, 2004. View at Publisher · View at Google Scholar
  5. J. W. Müller, A. Metz, and R. Hezel, “A new and simple approach for fabricating inverted pyramids on crystalline silicon solar cells,” in Proceedings of the 17th European Photovoltaic Solar Energy Conference and Exhibition (EUPVSEC '01), Munich, Germany, October 2001.
  6. P. Panek, “Effect of macroporous silicon layer on opto-electrical parameters of multicrystalline silicon solar cell,” Opto-Electronics Review, vol. 12, no. 1, pp. 45–48, 2004.
  7. S. W. Park, J. Kim, and S. H. Lee, “Application of acid texturing to multi-crystalline silicon wafers,” Journal of the Korean Physical Society, vol. 43, no. 3, pp. 423–426, 2003.
  8. S. Lust, C. Lévy-Clément, and C. Vard et al., “First multicrystalline si solar cells with electrochemical macroporus texturization,” in Proceedings of the 17th European Photovoltaic Solar Energy Conference and Exhibition (EUPVSEC '01), pp. 1436–1439, Munich, Germany, October 2001.
  9. R. Younkin, J. E. Carey, E. Mazur, J. A. Levinson, and C. M. Friend, “Infrared absorption by conical silicon microstructures made in a variety of background gases using femtosecond-laser pulses,” Journal of Applied Physics, vol. 93, no. 5, pp. 2626–2629, 2003. View at Publisher · View at Google Scholar
  10. W. Jooß, “Multicrystalline and back contact buried contact silicon solar cells,” Doctor of the natural sciences thesis, University of Konstanz, Konstanz, Germany, July 2002.
  11. A. Schneider, T. Pernau, K. Peter, and P. Fath, “Mechanical wafer stability enhancements and texturing effects of remote downstream plasma etching,” in Proceedings of the 3rd World Conference on Photovoltaic Energy Conversion (WCPEC '03), vol. 2, pp. 1419–1422, Osaka, Japan, May 2003. View at Publisher · View at Google Scholar
  12. G. Kumaravelu, M. M. Alkaisi, and A. Bittar, “Surface texturing for silicon solar cells using reactive ion etching technique,” in Proceedings of the 29th IEEE Photovoltaic Specialists Conference (PVSC '02), pp. 258–261, New Orleans, La, USA, May 2002.
  13. H. Jansen, M. de Boer, R. Legtenberg, and M. Elwenspoek, “Black silicon method: a universal method for determining the parameter setting of a fluorine-based reactive ion etcher in deep silicon trench etching with profile control,” Journal of Micromechanics and Microengineering, vol. 5, no. 2, pp. 115–120, 1995. View at Publisher · View at Google Scholar
  14. K. Takahashi, M. Hori, and T. Goto, “Fluorocarbon radicals and surface reactions in fluorocarbon high density etching plasma. I. O2 addition to electron cyclotron resonance plasma employing CHF3,” Journal of Vacuum Science and Technology A, vol. 14, no. 4, pp. 2011–2019, 1996. View at Publisher · View at Google Scholar
  15. Z. He and K. T. Leung, “Vibrational electron energy loss studies of surface processes on Si(111) 7×7 and vitreous Sio2 ion-mediated in CF4 and CH2F2,” Surface Science, vol. 523, no. 1-2, pp. 48–58, 2003. View at Publisher · View at Google Scholar
  16. J. Bhardwaj, H. Ashraf, and A. McGuarrie, “Dry silicon etching for MEMS,” in Proceedings of the Meeting of the Electrochemical Society, Microstructures and Microfabricated Systems III Symposium, vol. 97-5, pp. 118–130, Montreal, Quebec, Canada, May 1997.
  17. R. A. Morgan, Plasma Etching in Semiconductor Fabrication, vol. 1, Elsevier, Amsterdam, The Netherlands, 1985.