Table of Contents
International Journal of Plasma Science and Engineering
Volume 2009 (2009), Article ID 308949, 10 pages
Research Article

Plasma-Induced Damage on the Reliability of Hf-Based High-k/Dual Metal-Gates Complementary Metal Oxide Semiconductor Technology

1Institute of Electronics, National Chiao Tung University, 1001 Ta-Hsueh Road, Hsinchu 300, Taiwan
2National Nano Device Laboratories, Science-Based Industrial Park, 26 Prosperity Road 1, Hsinchu 30078, Taiwan

Received 15 April 2009; Revised 23 July 2009; Accepted 30 September 2009

Academic Editor: Paul K. Chu

Copyright © 2009 Wu-Te Weng et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


This study examines the effects of plasma-induced damage (PID) on Hf-based high-k/dual metal-gates transistors processed with advanced complementary metal-oxide-semiconductor (CMOS) technology. In addition to the gate dielectric degradations, this study demonstrates that thinning the gate dielectric reduces the impact of damage on transistor reliability including the positive bias temperature instability (PBTI) of n-channel metal-oxide-semiconductor field-effect transistors (NMOSFETs) and the negative bias temperature instability (NBTI) of p-channel MOSFETs. This study shows that high-k/metal-gate transistors are more robust against PID than conventional SiO2/poly-gate transistors with similar physical thickness. Finally this study proposes a model that successfully explains the observed experimental trends in the presence of PID for high-k/metal-gate CMOS technology.