Compression-Induced Solidification: A Novel Processing Technique for Precise Thermoplastic Optical Components with Negligible Internal Stresses

Table 2

Experimental settings for CIS with varying compression pressure.

Melt temperature [^°C]	270
Test temperature (high mold temperature) [^°C]	170
Adapting time [s]	420
Compression pressure [bars]	600–1000 in steps of 100
Packing time of compression [s]	3
Process during cooling [−]	Isochoric
Cooling time [s]	360
Demolding temperature (low mold temperature) [^°C]	100