Table of Contents
ISRN Electronics
Volume 2012 (2012), Article ID 916259, 9 pages
http://dx.doi.org/10.5402/2012/916259
Research Article

A Survey Addressing On-Chip Interconnect: Energy and Reliability Considerations

Department of Electrical Engineering and Computer Science, Oregon State University, Corvallis, OR 97331, USA

Received 25 January 2012; Accepted 26 February 2012

Academic Editor: S. Nikolaidis

Copyright © 2012 Jacob Postman and Patrick Chiang. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Jacob Postman and Patrick Chiang, “A Survey Addressing On-Chip Interconnect: Energy and Reliability Considerations,” ISRN Electronics, vol. 2012, Article ID 916259, 9 pages, 2012. doi:10.5402/2012/916259