Table of Contents
ISRN Mechanical Engineering
Volume 2013, Article ID 682586, 19 pages
http://dx.doi.org/10.1155/2013/682586
Review Article

Thermal Transport across Solid Interfaces with Nanoscale Imperfections: Effects of Roughness, Disorder, Dislocations, and Bonding on Thermal Boundary Conductance

Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA 22904, USA

Received 20 November 2012; Accepted 7 December 2012

Academic Editors: Y. He, T. Ohara, and Z. Yu

Copyright © 2013 Patrick E. Hopkins. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Patrick E. Hopkins, “Thermal Transport across Solid Interfaces with Nanoscale Imperfections: Effects of Roughness, Disorder, Dislocations, and Bonding on Thermal Boundary Conductance,” ISRN Mechanical Engineering, vol. 2013, Article ID 682586, 19 pages, 2013. https://doi.org/10.1155/2013/682586.