Effects of Added Chloride Ion on Electrodeposition of Copper from a Simulated Acidic Sulfate Bath Containing Cobalt Ions

Figure 4

XRD patterns of electrodeposited copper samples. Key: added [Co²⁺]_o  X ppm + [Cl⁻]_o  Y ppm (a) Bl; (b) 0 + 5 ppm; (c) 0 + 100 ppm; (d) 150 ppm + 0; (e) 150 ppm + 5 ppm; (f) 150 ppm + 10 ppm; (g) 150 ppm + 50 ppm; (h) 150 ppm + 100 ppm. (Cu²⁺ = 20 g/L, H₂SO₄ = 30 g/L, 𝑇=30±1°C, CD = 150 A/m², 𝑡_𝑑=2 hr).