Electronic Nose Based on Nanomaterials: Issues, Challenges, and Prospects

Figure 6

NW fabrication process and SEM images of synthesized single NWs. (a) 4-in. Si wafer containing 69, 1 cm × 1 cm chips. (b) A chip placed under three probes of a probe station during NW electrochemical deposition. (c) Chip containing four different single NWs. (d) Sensor chip built on a chip with a single-NW array after wire bonding and integration. ((e)–(g)) SEM images of Pd, PPy, and PANI single NWs, respectively. The bright thin line denotes the NW, and the bright areas on top and bottom denote Ti/Au electrodes. (h) SEM image of ZnO NW. (i) Measurement setup for the read-out of sensor signal. Published with permission from Hu et al. [101] Copyright © 2013 Elsevier.