Table of Contents
Journal of Computational Engineering
Volume 2015 (2015), Article ID 428073, 9 pages
http://dx.doi.org/10.1155/2015/428073
Research Article

Finite Element Analysis of System-Level Electronic Packages for Space Applications

1Department of Mechanical and Industrial Engineering, Montana State University, Bozeman, MT 59717, USA
2Department of Mechanical and Materials Engineering, Wright State University, Dayton, OH 45435, USA
3Department of Electrical and Computer Engineering, Montana State University, Bozeman, MT 59717, USA

Received 25 September 2014; Revised 30 January 2015; Accepted 16 February 2015

Academic Editor: Liudong Xing

Copyright © 2015 Adrien Lambert et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Adrien Lambert, Ahsan Mian, Justin Hogan, Todd Kaiser, and Brock LaMeres, “Finite Element Analysis of System-Level Electronic Packages for Space Applications,” Journal of Computational Engineering, vol. 2015, Article ID 428073, 9 pages, 2015. doi:10.1155/2015/428073