Finite Element Analysis of System-Level Electronic Packages for Space Applications

Table 1

Relevant thermomechanical material properties.

Material	Thermal conductivity (W/m-K)	Specific heat (J/kgK)	Emissivity	Density (kg/m^3)
FR4	0.27	915	N/A	1820
Polystyrene insulation	0.036	1200	N/A	30
Aluminum	177	875	0.1	2790
White paint	0.000017	N/A	0.99	801
Plastic interconnects	3.976	1500	N/A	1610
Copper	401	385	0.05	8933
PVC plate	0.19	900	0.85	527

Emissivity not specified for materials with minimal thermal radiation.