Effects of Hard Surface Grinding and Activation on Electroless-Nickel Plating on Cast Aluminium Alloy Substrates

<table>Micrographs showing EN deposition on (a) 60 <i>μ</i>m polished, (b) 320 <i>μ</i>m polished, (c) 600 <i>μ</i>m polished, (d) 800 <i>μ</i>m, (e) 1200 <i>μ</i>m polished Al alloy substrates, and (f) 60 <i>μ</i>m polished zincated substrate.</table>

Journal of Coatings

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Figure 5

Figure 5: Effects of Hard Surface Grinding and Activation on Electroless-Nickel Plating on Cast Aluminium Alloy Substrates 