Effects of Hard Surface Grinding and Activation on Electroless-Nickel Plating on Cast Aluminium Alloy Substrates

Figure 6

Micrographs showing EN deposition on (a)–(f) 60 μm cast Al alloy substrates.

(a) Noncoated

(b) Nonmetallic and dull EN deposition at 80°C

(c) Dull EN deposition at 85°C

(d) Bright EN deposition at 90°C

(e) PdCl₂ activated EN chips at 85°C

(f) PdCl₂ activated dull EN flakes at 90°C