Importance of Molds for Nanoimprint Lithography: Hard, Soft, and Hybrid Molds

Figure 5

Schematic diagram of sputtering system (magnetron sputtering) showing the trajectory of the target atoms deposited on the substrate (dashed red line). As the argon ions that are bombarded on the target to cause the scattering have random velocity vector, scattered target atoms have random velocity vector. These random velocity vectors cause the side wall deposition (dashed inset). The ideal case of sputtering for optimized lift-off result is shown in solid inset.