Table of Contents
Journal of Polymers
Volume 2014 (2014), Article ID 645832, 8 pages
Research Article

Synthesis and Characterization of Polyesteramide Hot Melt Adhesive from Low Purity Dimer Acid, Ethylenediamine, and Ethanolamine

1Department of Polymer and Surface Engineering, Institute of Chemical Technology, Matunga, Mumbai, Maharashtra 400 019, India
2Department of Oils, Oleochemicals and Surfactants Technology, Institute of Chemical Technology, Matunga, Mumbai, Maharashtra 400 019, India

Received 7 December 2013; Revised 3 March 2014; Accepted 11 March 2014; Published 7 April 2014

Academic Editor: Beng T. Poh

Copyright © 2014 Pravin G. Kadam et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Polyesteramide hot melt adhesive (HMA) was synthesized using low purity dimer acid (composition: 3% linoleic acid, 75% dimer acid, and 22% trimer acid), ethanolamine, and ethylenediamine. Ethanolamine was added as a partial replacement (10, 20, and 30%) of ethylenediamine. Prepared HMAs were characterized for acid value, amine value, hydroxyl value, Fourier transform infrared spectroscopy, mechanical (tensile strength, percentage strain at brea, and shore D hardness), thermal (glass transition temperature, melting temperature, enthalpy of melting, crystallization temperature, and enthalpy of crystallization), rheological (viscosity versus shear rate and viscosity versus time), and adhesion properties (T-peel strength and lap shear strength). Replacement of ethylenediamine by ethanolamine replaced certain amide linkages by ester linkages, decreasing the intermolecular hydrogen bonding, leading to decrease in the crystallinity of the material, and thus the mechanical, thermal, adhesion, and rheological properties. However, HMAs prepared using ethanolamine will have better low temperature flexibility due to low glass transition temperature and better adhesion process due to the lower viscosity.