Table of Contents
Laser Chemistry
Volume 2008, Article ID 976205, 6 pages
Research Article

Three-Dimensional Modeling of the Heat-Affected Zone in Laser Machining Applications

1Institute of Materials Science and Applied Research, Saulėtekio 9, 2040 Vilnius, Lithuania
2Altechna Co. Ltd., Konstitucijos Avenue 23C-604, 08105 Vilnius, Lithuania
3Laser Research Center, Vilnius University, Saulėtekio 10, 10223 Vilnius, Lithuania
4Research Institute for Electronic Science, Hokkaido University, N21W10, Kitaku, Sapporo 001-0021, Japan

Received 5 May 2008; Accepted 16 September 2008

Academic Editor: Stavros Pissadakis

Copyright © 2008 Martynas Beresna et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Thermal load as well as its three-dimensional (3D) spatial distribution has been estimated inside representative materials: glass (low thermal diffusion), silicon (semimetal properties), and sapphire (a crystalline dielectric of a high thermal conductivity) for typical laser processing and direct laser writing applications. The 3D temperature distribution allows to calculate thermal stress around the focal region. This provides an assessment tool for optimization of laser microprocessing conditions for controlled laser dicing and cutting applications.