Texture, Stress, and Microstructure

Texture, Stress, and Microstructure / 1991 / Article
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Ninth International Conference on Textures of Materials

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Volume 14 |Article ID 463232 | https://doi.org/10.1155/TSM.14-18.629

H. Hammelrath, J. F. Bulter, H. Hu, K. Lücke, "Deformation and Recrystallization Textures of Rolled and Channel-Die Compressed High Purity Copper", Texture, Stress, and Microstructure, vol. 14, Article ID 463232, 6 pages, 1991. https://doi.org/10.1155/TSM.14-18.629

Deformation and Recrystallization Textures of Rolled and Channel-Die Compressed High Purity Copper


Pure copper was deformed in two different ways between 70%-95% and subsequently primary recrystallized. With the help of ODF-analysis the deformation and recrystallization textures for the different deformation degrees were determined. Noticeable differences were observed in both the deformation and recrystallization textures of the strips produced by these two deformation modes. For deformation texture the rolled strip shows stronger C- and S-, but weaker B-orientation in comparison with channel-die compressed strips. Also the orientation scattering is larger in the rolled strips. For the recrystallized specimen the Cube is stronger and the twin orientation is weaker than in the channel-die compressed strip. These observed differences are all more prominent at higher reductions. The causes of this differences will be discussed.

Copyright © 1991 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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