Abstract
It is shown that the deformation banding tendency in copper increases as deformation temperature increases. After 70% compression, the average number of deformation bands per grain increases from 16 to 36 as the deformation temperature increases from 25 to 300℃. An orientation dependence of banding tendency is also observed. Grains with near {110} orientation are found to have the lowest banding tendency. The textures of samples compressed below 300℃ are similar and consist mainly of a {110} fibre and a weak {100} fibre. While the {110} component remains when deformation temperature is increased to 300℃; the {100} component becomes weaker. 300℃ is in fact the temperature at which large scale dynamic recrystallisation occurs. It is suspected that the decay of the {100} component is due to dynamic recrystallisation which takes place preferentially at thin deformation bands where most of the {100} oriented material is found.