Table of Contents
Textures and Microstructures
Volume 26 (1996)–27
http://dx.doi.org/10.1155/TSM.26-27.137

Texture and Microstructure of Compressed Copper

1Department of Physics and Materials Science, City University of Hong Kong, 83 Tat Chee Avenue, Hong Kong, China
2School of Metallurgy and Materials, University of Birmingham, Birmingham B15 2TT, UK

Received 16 November 1995

Copyright © 1996 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

It is shown that the deformation banding tendency in copper increases as deformation temperature increases. After 70% compression, the average number of deformation bands per grain increases from 16 to 36 as the deformation temperature increases from 25 to 300℃. An orientation dependence of banding tendency is also observed. Grains with near {110} orientation are found to have the lowest banding tendency. The textures of samples compressed below 300℃ are similar and consist mainly of a {110} fibre and a weak {100} fibre. While the {110} component remains when deformation temperature is increased to 300℃; the {100} component becomes weaker. 300℃ is in fact the temperature at which large scale dynamic recrystallisation occurs. It is suspected that the decay of the {100} component is due to dynamic recrystallisation which takes place preferentially at thin deformation bands where most of the {100} oriented material is found.